skr 22,4 qu bond ? by semikron rev. 1 ? 19.02.2010 1 diode skr i f(dc) = 770 a v rrm = 1600 v size: 22,4 mm x 22,4 mm skr 22,4 qu bond features ? high current density due to mesa technology ? high surge current ? compatible to thick wire bonding ? compatible to all standard solder processes typical applications* ? uncontrolled rectifier bridges absolute maximum ratings symbol conditions values unit v rrm t j =25c, i r =2ma 1600 v i f(av) t c =80c, t j = 150 c 630 a i 2 t t j = 150 c, 10 ms, sin 180 446500 a 2 s i fsm 10 ms sin 180 t j =25c 10500 a t j = 150 c 9450 a t jmax 150 c electrical char acteristics symbol conditions min. typ. max. unit i r t j =25c, v rrm 2ma t j = 120 c, v rrm 3.3 ma v f t j =25c, i f = 550 a 11.21v t j = 125 c, i f = 550 a 0.9 1.1 v v (to) t j = 125 c 0.83 v r t t j = 125 c 0.3 m ? t rr t j =25c, 1a 72 s thermal characteristics symbol conditions min. typ. max. unit t j -40 150 c t stg -40 150 c t solder 10 min. 250 c t solder 5 min. 320 c r th(j-c) semipack 2 assembly 0.085 k/w mechanical characteristics symbol conditions values unit raster size 22.4 x 22.4 mm 2 area total 501.76 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package tray chips / package 9pcs
skr 22,4 qu bond 2 rev. 1 ? 19.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), international standard iec 60747-1, chapter ix * the specifications of our components may not be considered as an assurance of component characteristics. components have to b e tested for the respective application. adjustments may be necessary. t he use of semikron products in life support appliances and syste ms is subject to prior specification and written approval by semikron . we therefore strongly recommend prior consultation of our pers onal.
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